Silicon Interposers enable high performance capacitors
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چکیده
©ALLVIA, Inc. 2011 Sunnyvale, CA www.allvia.com Page 1 Interposers between ICs and package substrates that contain thin film capacitors have been used previously in order to improve circuit performance. However, with the interconnect inductance due to wire bonds being high, the benefits of thin film capacitors have not been fully realized. Replacing the wire bonds with Through Silicon Vias (TSVs) in the interposers with capacitors provide the shortest electrical path between devices and the decoupling capacitors. TSVs with their very low inductance will enable higher electrical performance when integrated with embedded thin film capacitors.
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